FH05/FH10 SERIES

Dimensions (mm)

Spec

• Resistance tolerance ・・・・・・・・・・・・・・・・・・・
±1%, ±2%, ±3%(R25)
• B value tolerance・・・・・・・・・・・・・・・・・・・・・・・
±1%(B25/50)
• Termination・・・・・・・・・・・・・・・・・・・・・・・・・・・・・
Au
• Operating temperature range・・・・・・・・・・・
-40℃~+125℃
• Heat dissipation ・・・・・・・・・・・・・・・・・・・・・・・
(FH05):0.15mW/℃
(FH10):0.3mW/℃
 
• Maximum power dissipation・・・・・・・・・・・・
(FH05):15mW
(FH10):30mW

*Heat dissipation and Maximum power dissipation are applied to thermistor connected O0.1mm CuNi wire by solder.

Features

•Small precision type

•Long-life Reliability

•Excellent solderability,bondability

•Excellent stability against Au/Sn soldering process(about 300℃)

Characteristics

FH05, FH10 Series

Type
Resistance
R25
Resistance Tolerance
B Value
B25/50
B Value
R-T DATA
±1%
±2%
±3%
PDF CSV
FH05-6D103
10kΩ
3,930K
FH10-6E103
10kΩ
3,950K
FH10-6Q103
10kΩ
3,410K
FH10-3U104
100kΩ
3,950K

Recommended Soldering Profile

Solder:
Au/Sn(80/20) preform
Atmosphere:
N2gases(O2:50ppm.or less)

1) Time shown in the above figures is measured from the point when chip surface reaches temperature.

2) Please keep exposure to temperature exceeding 280℃ to under 50seconds.

3) After soldering,do not force cool,allow the parts to cool gradually.